Xiaomi has unveiled the Xring O3, its latest in-house flagship chipset, as the company pushes to reduce its dependence on third-party chipmakers. The new 3nm processor is set to debut in the Xiaomi 18 Fold and Pad 9 Pro Max in September.
Xiaomi claims the Xring O3 is the first mobile system-on-chip to cross 5 million points on AnTuTu, achieving a reported score of 5.22 million. The chip features a 10-core CPU, with Xiaomi claiming up to 60% higher performance.
The Xring O3 also includes a 16-core G2-Ultra NX GPU. Xiaomi says it delivers up to 85% better graphics performance while improving power efficiency by 64%. The company is also introducing LPDDR6 memory support, with claimed bandwidth of up to 113.8GB/s.
Artificial intelligence is another major focus, with Xiaomi claiming up to 200 TOPS of tensor performance and a 45% improvement in NPU performance.
Alongside the Xring O3, Xiaomi introduced the AI-focused Xring O100 and the Xring D100 for intelligent-driving applications. The new chips highlight Xiaomi’s broader strategy to develop in-house silicon for smartphones, AI and its expanding hardware ecosystem.
Real-world performance will become clearer after the first Xring O3-powered devices launch in September.
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